Intel has given a close-up of its next-gen Meteor Lake shopper and Granite Rapids knowledge heart CPUs which make the most of superior packaging applied sciences.
Intel Exhibits Off Its Superior Packaging Prowess With Subsequent-Gen Granite Rapids Information Heart & Meteor Lake Shopper CPU Chip Pictures
In a PR revealed by Intel, Chipzilla highlights the varied chipmaking applied sciences which can be being utilized at its Arizona and Oregon fabs for the manufacturing of next-gen chips. Intel, whereas being late to the chiplet period, has picked up the tempo just lately with its Sapphire Rapids and Ponte Vecchio not solely being superior chiplet designs however taking it to the subsequent degree via the usage of Foveros and EMIB applied sciences. The corporate’s disaggregated chiplet roadmap additionally takes form later this fall with the launch of Meteor Lake, its first full-on chiplet design, and the primary “Core Extremely” lineup for purchasers.
Following Meteor Lake, Intel will as soon as once more be firing up all barrels within the knowledge heart phase with not one however two distinct Xeon households, the P-Core-based Granite Rapids & the E-Core-based Sierra Forest.
At the moment’s close-up offers us a have a look at the 2nd Gen chiplet-based Information Heart product, Granite Rapids-SP, which might be appropriate with the LGA 4710 socket (Birch Stream platform). This large chip consists of 5 chiplets with the three within the center being an XCC Compute tile whereas the 2 on the outer sides liable for I/O and extra controllers. Intel additionally exhibits off the natural sub-strate layer & which will be seen using a minimum of 8 EMIB interconnects for every separate chiplet.
We additionally get a close-up on Intel’s Meteor Lake CPUs and whereas we now have seen the die shot on a number of events, this time we get to see an fascinating package deal that’s coupled with on-die reminiscence. This specific SKU makes use of two LPDDR5x DRAM dies from Samsung (K3KL3L30CM) on the identical package deal & will end in some very fascinating mobility options, particularly by way of measurement & compactness. There will even be the usual off-package DRAM options throughout the Meteor Lake lineup.
Intel’s superior packaging applied sciences lengthen and drive Moore’s Regulation as the corporate aspires to a trillion transistors in a package deal by 2030. Intel has led the business in superior packaging for a pair many years. Its improvements embrace EMIB (embedded multi-die interconnect bridge) and Foveros, applied sciences that enable a number of chips on a package deal to be linked facet by facet (EMIB) or stacked on prime of each other in a 3D vogue (Foveros).
As Moore’s Regulation has been progressing, conventional scaling has been slowing down,” says Ann Kelleher, govt vice chairman and normal supervisor of Intel’s Expertise Growth. “However as we begin doing superior packaging and heterogeneous integration, it means we will pack much more elements right into a given package deal and a given product.
Intel’s packaging expertise can also be a aggressive benefit for Intel Foundry Companies (IFS).
by way of Intel
Intel’s Meteor Lake CPU lineup is predicted to be unveiled on the upcoming Innovation occasion this month whereas Granite Rapids CPUs are anticipated to ship round mid-2024.